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Acme Circuit Boards Assembly starting doing electronics
contract manufacturing for SMT assembly (SMTA) since
year 1994. Manufacturing in Carson which is in 10 miles south of Los Angeles
airport, CA. ISO 9002 certified is a
guarantee for all right process at EMS.
High speed pick & place machine set up for all
median to large run SMT assembly (SMTA). It includes Fuji assembly line. X-ray
inspection for high quality SMTA purpose. Amistar fine pitch can go down to 12
mil SMT fine pitch components and Mydata pick & place machine give us
more flexibility for small run, and prototype board build up. We can do IPC
610 Class III if customer required, otherwise, all the PCB
assembly (PCBA) followed by IPC 610 class II standard.
As usual, We keep additional capacity, shorter time-to-market and
State-of-the-art manufacturing capabilities. Fuji NXT Surface Mount
Technology (SMT) pick and place machine give us the capability to working on
Surface Mount Technology (SMT) component package smaller than 01 005 which
is 1/4 size of 0201 component.
PCB shape and fiducial mark and other requirement is
important for SMTA(A
Fidutial Mark is an optical marker used as a reference by automated pick and
place machine to ensure accurate placement of surface mount components).
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Board size should be less than 18.5 inch x 14 inch for SMTA.
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Board thickness need between 20 mil to 160 mil for SMTA.
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Fiducial mark is a foil element on a Printed Circuit Board
that is viewed by machine vision to determine the location of the (pad)
pattern on the PCB. This allows a shown in their proper location. For the
best results place fiducials near the bottom (more than 0.5 inch from the
bottom) as far apart as possible, but not more than 13 inch apart. Put the
first fiducial near the leading edge of the PCB. Please review
Fiducial Mark requirement.pdf
for more information.
- The Preferred Surface Mount Technology (SMT) board is one which has
Surface Mount Technology (SMT) components on one side only. If all of
the components are not available in Surface Mount Technology (SMT) form,
Thru-hoe components on the same side as Surface Mount Technology (SMT)
components is an acceptable solution.
- Surface Mount Technology (SMT) components may be placed on both
sides of the Printed Circuit Board (PCB) with additional components are
also on the Printed Circuit Board (PCB); or if Surface Mount Technology
(SMT) components are on one side of the board, and Thru hole components
are on the other side, please contact our manufacturing engineer for
specific guidelines for your application.
- All Foil near a Surface Mount Technology (SMT) pad must be
covered with solder mask, especially any traces that pass between
components pads.
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For Kit assembly orders, please send
5% parts or 5 pcs extra, whichever
is more, for discrete component.
For active parts, please send 1% or
1 pc extra, whichever is more.
Unused active parts will be returned
to the customer.
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We need following files for PCB
assembly orders:
BOM (Bill of Material) in Microsoft
Excel format. For any component not
to be placed, please mark "NP" (Not
Plated). The BOM should include at
least (1) Reference designators
such as U1, R3; (2) Quantities; (3)
Manufacture part numbers; (4) Foot
prints (package shapes; (5) Values.
Gerber
files
Pick
& Place file if automated machine
placement is required. We may help
generate the P&P file for you from
your Gerber files but the P&P file
generated from your CAD is the most
preferred.
Silkscreen file with markings on
polarity and pin-1 positions. |
SMD (surface mount device) & through-hole
device assembly.
SMT passive parts smaller as 01 005 package
size.
BGA and micro BGA assembly (minimum BGA SMT
pitch 0.3 mm)
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Acme PCB assembly
161 Selandia Lane Carson, CA
90746

BGA assembly with X-ray inspection
Customer
Service a
good communication with customer is the key to win the buiness
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